MPi Fine Pictch Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is extensively applied on gold bump and pad wafer screening for Exhibit driver, logic, and memory gadget. MPI’s cantilever probes would be the corresponding reply for the demands of fi­ne pitch, modest pad dimensions, superior pace, considerably less cleansing, multi-DUT, high pin depend, and ultra-reduced leakage demands. With superb craftsmanship, ground breaking architecture and demonstrated methodologies based on mechanical and electrical simulation/measurement outcomes, making MPI the top cantilever service provider around the world.


FCB Probe Card

The FCB Probe Card is easily the most experienced technology of buckling beam probe card. It's aimed to realize the semiconductor ship manufacture time-to-market (TTM) and price of take a look at (COT) demand. FCB is often a verified Resolution for various semiconductor production assessments from early engineering pilot-operates to high volume production (HVM). FCB is prepared for unit necessitating high signal integrity probing (SI) and/or power integrity probing (PI). Purposes involve chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB ensures the whole world’s most effective overall cost-of-possession (COO) for many DUT applications.


EVS Probe Card

The EVS Probe Card is an improvement above the traditional buckling beam probe card. Key features are better recent carrying capability (C.C.C.) and reduce well balanced Call pressure (BCF), and also General MEMS-like traits. EVS can certainly meet up with the requirement of Highly developed wafer probing. Specific alignment and superb planarity Handle are classified as the key aspects contributing to stable Call resistance. With its ability and functionality, EVS Probe Card is an ideal option for Superior probe cards.


Osprey probe card

The Osprey probe card is MPI’s Option to demand from customers for at any time finer pitch. It's designed for smaller sized Al pad, and is also ideal for small pitch application with peripheral and total array pattern. With exact alignment and much better planarity Manage, Osprey can arrive at increased efficiency by multi-DUT style and design.  The forming wire (FW) variety needle produced with MPI’s possess micro fabrication system not merely delivers large-excellent overall performance get more info but in addition will allow simple needle alternative and shortens sustaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is provided with MEMS wire (MW) needle which can be suitable for the demand of low force probing. Additionally, it comes with the ability to fulfill substantial C.C.C. and substantial pin counts software. The MEMS system makes certain really steady needle properties, and also the Distinctive composition layout enables precise alignment and planarity Handle.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

Leave a Reply

Your email address will not be published. Required fields are marked *